Granted Patent
Utility
US 4,970,574 · App. 07/359,139
Electromigrationproof structure for multilayer wiring on a semiconductor device
Inventor:
Kinji Tsunenari
Patented Case
View Patent ↗
Granted: Nov 13, 1990
Filed: May 31, 1989
Inventor
Kinji Tsunenari
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.