Granted Patent
Utility
US 4,978,639 · App. 07/295,300
Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips
Inventors:
Chang-Hwang Hua, Simon S. Chan, Ding-Yuan S. Day, Adrian Lee
Patented Case
View Patent ↗
Granted: Dec 18, 1990
Filed: Jan 10, 1989
Inventors
Chang-Hwang Hua
Simon S. Chan
Ding-Yuan S. Day
Adrian Lee
Assignee (at issue)
Avantek, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.