Granted Patent
Utility
US 4,994,402 · App. 07/400,609
Method of fabricating a coplanar, self-aligned contact structure in a semiconductor device
Inventor:
Kuang-Yi Chiu
Patented Case
View Patent ↗
Granted: Feb 19, 1991
Filed: Aug 30, 1989
Inventor
Kuang-Yi Chiu
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.