Granted Patent
Utility
US 5,000,827 · App. 07/459,892
Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
Inventors:
Virgil E. Schuster, Reginald K. Asher, Bhagubhai D. Patel
Patented Case
View Patent ↗
Granted: Mar 19, 1991
Filed: Jan 2, 1990
Inventors
Virgil E. Schuster
Reginald K. Asher
Bhagubhai D. Patel
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.