Granted Patent
Utility
US 5,010,232 · App. 07/468,914
Method of and apparatus for perforating printed circuit board
Inventors:
Kunio Arai, Yasuhiko Kanaya
Patented Case
View Patent ↗
Granted: Apr 23, 1991
Filed: Jan 23, 1990
Inventors
Kunio Arai
Yasuhiko Kanaya
Assignee (at issue)
Hitachi Seiko Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.