Granted Patent
Utility
US 5,019,535 · App. 07/329,478
Die attachment method using nonconductive adhesive for use in high density interconnected assemblies
Inventors:
Robert J. Wojnarowski, Charles W. Eichelberger
Patented Case
View Patent ↗
Granted: May 28, 1991
Filed: Mar 28, 1989
Inventors
Robert J. Wojnarowski
Charles W. Eichelberger
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.