Granted Patent
Utility
US 5,032,889 · App. 07/585,515
Wiring structure in a wafer-scale integrated circuit
Inventors:
Toshiaki Murao, Takeo Kikuchi, Toshihiko Iryu, Hiroyuki Sugamoto, Hidenori Nomura
Patented Case
View Patent ↗
Granted: Jul 16, 1991
Filed: Sep 20, 1990
Inventors
Toshiaki Murao
Takeo Kikuchi
Toshihiko Iryu
Hiroyuki Sugamoto
Hidenori Nomura
Assignee (at issue)
Fujitsu Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.