Granted Patent
Utility
US 5,069,002 · App. 07/686,686
Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
Inventors:
Gurtej S. Sandhu, Laurence D. Schultz, Trung T. Doan
Patented Case
View Patent ↗
Granted: Dec 3, 1991
Filed: Apr 17, 1991
Inventors
Gurtej S. Sandhu
Laurence D. Schultz
Trung T. Doan
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.