Granted Patent
Utility
US 5,069,749 · App. 07/239,036
Method of fabricating interconnect layers on an integrated circuit chip using seed-grown conductors
Inventor:
Jean-Marie Gutierrez
Patented Case
View Patent ↗
Granted: Dec 3, 1991
Filed: Aug 29, 1988
Inventor
Jean-Marie Gutierrez
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.