Granted Patent
Utility
US 5,083,193 · App. 07/389,718
Semiconductor package, method of manufacturing the same, apparatus for carrying out the method, and assembly facility
Inventors:
Viktor Heitzler, Richard Kapp
Patented Case
View Patent ↗
Granted: Jan 21, 1992
Filed: Aug 4, 1989
Inventors
Viktor Heitzler
Richard Kapp
Assignee (at issue)
Deutsche ITT Industries, GmbH
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.