Granted Patent
Utility
US 5,097,101 · App. 07/650,549
Method of forming a conductive contact bump on a flexible substrate and a flexible substrate
Inventor:
Douglas W. Trobough
Patented Case
View Patent ↗
Granted: Mar 17, 1992
Filed: Feb 5, 1991
Inventor
Douglas W. Trobough
Assignee (at issue)
Tektronix, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.