Granted Patent
Utility
US 5,100,829 · App. 07/648,072
Process for forming a semiconductor structure with closely coupled substrate temperature sense element
Inventors:
Gary V. Fay, Stephen P. Robb, Judith L. Sutor, Lewis E. Terry
Patented Case
View Patent ↗
Granted: Mar 31, 1992
Filed: Mar 1, 1991
Inventors
Gary V. Fay
Stephen P. Robb
Judith L. Sutor
Lewis E. Terry
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.