Granted Patent
Utility
US 5,103,290 · App. 07/367,525
Hermetic package having a lead extending through an aperture in the package lid and packaged semiconductor chip
Inventors:
Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, James F. Burgess, Homer H. Glascock, II
Patented Case
View Patent ↗
Granted: Apr 7, 1992
Filed: Jun 16, 1989
Inventors
Victor A. K. Temple
Donald L. Watrous
Constantine A. Neugebauer
James F. Burgess
Homer H. Glascock, II
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.