Granted Patent
Utility
US 5,110,036 · App. 07/628,789
Method and apparatus for solder leveling of printed circuit boards
Inventor:
John Parker
Patented Case
View Patent ↗
Granted: May 5, 1992
Filed: Dec 17, 1990
Inventor
John Parker
Assignee (at issue)
AT&T Bell Laboratories
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.