IP Library › Granted Patent US 5,113,314
Granted Patent Utility
US 5,113,314 · App. 07/645,913

High-speed, high-density chip mounting

Inventors: Richard L. Wheeler, Voddarahalli K. Nagesh
Patented Case View Patent ↗
Granted: May 12, 1992 Filed: Jan 24, 1991
Inventors
Richard L. Wheeler
Voddarahalli K. Nagesh
Assignee (at issue)
Hewlett-Packard Company, L.P.

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Quick Facts
Patent No.
US 5,113,314
App. No.
07/645,913
Filed
1991-01-24
Granted
1992-05-12
Kind
A