Granted Patent
Utility
US 5,114,556 · App. 07/457,347
Deposition apparatus and method for enhancing step coverage and planarization on semiconductor wafers
Inventor:
Lawrence T. Lamont, Jr.
Patented Case
View Patent ↗
Granted: May 19, 1992
Filed: Dec 27, 1989
Inventor
Lawrence T. Lamont, Jr.
Assignee (at issue)
Vaccine Technology Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.