Granted Patent
Utility
US 5,124,644 · App. 07/630,115
System for positioning a semiconductor chip package with respect to a testing device
Inventor:
David Ganapol
Patented Case
View Patent ↗
Granted: Jun 23, 1992
Filed: Dec 19, 1990
Inventor
David Ganapol
Assignee (at issue)
VLSI Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.