Granted Patent
Utility
US 5,127,984 · App. 07/694,904
Rapid wafer thinning process
Inventors:
Chang-Hwang Hua, Ding-Yuan S. Day
Patented Case
View Patent ↗
Granted: Jul 7, 1992
Filed: May 2, 1991
Inventors
Chang-Hwang Hua
Ding-Yuan S. Day
Assignee (at issue)
Avantek, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.