Granted Patent
Utility
US 5,127,986 · App. 07/444,747
High power, high density interconnect method and apparatus for integrated circuits
Inventors:
Melvin C. August, Lloyd Shepherd, James N. Kruchowski
Patented Case
View Patent ↗
Granted: Jul 7, 1992
Filed: Dec 1, 1989
Inventors
Melvin C. August
Lloyd Shepherd
James N. Kruchowski
Assignee (at issue)
Cray Research, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.