IP Library › Granted Patent US 5,128,280
Granted Patent Utility
US 5,128,280 · App. 07/732,602

Fabrication process for wafer alignment marks by using peripheral etching to form grooves

Inventors: Ryoichi Matsumoto, Toshikazu Kuroda, Takao Kato
Patented Case View Patent ↗
Granted: Jul 7, 1992 Filed: Jul 19, 1991
Inventors
Ryoichi Matsumoto
Toshikazu Kuroda
Takao Kato
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.

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Quick Facts
Patent No.
US 5,128,280
App. No.
07/732,602
Filed
1991-07-19
Granted
1992-07-07
Kind
A