Granted Patent
Utility
US 5,129,573 · App. 07/782,428
Method for attaching through-hole devices to a circuit board using solder paste
Inventor:
Gregory A. Duffey
Patented Case
View Patent ↗
Granted: Jul 14, 1992
Filed: Oct 25, 1991
Inventor
Gregory A. Duffey
Assignee (at issue)
Compaq Computer Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.