Granted Patent
Utility
US 5,139,972 · App. 07/661,946
Batch assembly of high density hermetic packages for power semiconductor chips
Inventors:
Constantine A. Neugebauer, Victor A. K. Temple
Patented Case
View Patent ↗
Granted: Aug 18, 1992
Filed: Feb 28, 1991
Inventors
Constantine A. Neugebauer
Victor A. K. Temple
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.