Granted Patent
Utility
US 5,156,983 · App. 07/427,413
Method of manufacturing tape automated bonding semiconductor package
Inventors:
Randall L. Schlesinger, Ralph W. Doe, Richard D. Gates, Dennis P. Goddard, Shih-Chien Hsu
Patented Case
View Patent ↗
Granted: Oct 20, 1992
Filed: Oct 26, 1989
Inventors
Randall L. Schlesinger
Ralph W. Doe
Richard D. Gates
Dennis P. Goddard
Shih-Chien Hsu
Assignee (at issue)
Digtial Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.