IP Library › Granted Patent US 5,157,589
Granted Patent Utility
US 5,157,589 · App. 07/546,963

Mutliple lamination high density interconnect process and structure employing thermoplastic adhesives having sequentially decreasing T.sub.G ' s

Inventors: Herbert S. Cole, James Wilson Rose, Charles W. Eichelberger, Robert J. Wojnarowski
Patented Case View Patent ↗
Granted: Oct 20, 1992 Filed: Jul 2, 1990
Inventors
Herbert S. Cole
James Wilson Rose
Charles W. Eichelberger
Robert J. Wojnarowski
Assignee (at issue)
General Electric Company

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Quick Facts
Patent No.
US 5,157,589
App. No.
07/546,963
Filed
1990-07-02
Granted
1992-10-20
Kind
A