Granted Patent
Utility
US 5,161,093 · App. 07/546,959
Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive
Inventors:
Thomas Bert Gorczyca, Stanton Earl Weaver, Robert J. Wojnarowski
Patented Case
View Patent ↗
Granted: Nov 3, 1992
Filed: Jul 2, 1990
Inventors
Thomas Bert Gorczyca
Stanton Earl Weaver
Robert J. Wojnarowski
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.