Granted Patent
Utility
US 5,162,260 · App. 07/638,885
Stacked solid via formation in integrated circuit systems
Inventors:
Jacques Leibovitz, Maria L. Cobarruviaz, Kenneth D. Scholz, Clinton Chao
Patented Case
View Patent ↗
Granted: Nov 10, 1992
Filed: Jan 7, 1991
Inventors
Jacques Leibovitz
Maria L. Cobarruviaz
Kenneth D. Scholz
Clinton Chao
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.