Granted Patent
Utility
US 5,164,331 · App. 07/770,595
Method of forming and etching titanium-tungsten interconnects
Inventors:
Jung-Hong Lin, Warren M. Uesato, Leuh Fang
Patented Case
View Patent ↗
Granted: Nov 17, 1992
Filed: Oct 3, 1991
Inventors
Jung-Hong Lin
Warren M. Uesato
Leuh Fang
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.