IP Library › Granted Patent US 5,166,773
Granted Patent Utility
US 5,166,773 · App. 07/375,636

Hermetic package and packaged semiconductor chip having closely spaced leads extending through the package lid

Inventors: Victor A. K. Temple, Donald L. Watrous, Constantine A. Neugebauer, James F. Burgess, Homer H. Glascock, II
Patented Case View Patent ↗
Granted: Nov 24, 1992 Filed: Jul 3, 1989
Inventors
Victor A. K. Temple
Donald L. Watrous
Constantine A. Neugebauer
James F. Burgess
Homer H. Glascock, II
Assignee (at issue)
General Electric Company

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Quick Facts
Patent No.
US 5,166,773
App. No.
07/375,636
Filed
1989-07-03
Granted
1992-11-24
Kind
A