Granted Patent
Utility
US 5,167,511 · App. 07/618,603
High density interconnect apparatus
Inventors:
Nicholas J. Krajewski, Carl D. Breske, David Johnson, David R. Kiefer, Kent T. McDaniel, William T. Moore, Michael R. Edwards, Bricky A. Stephenson, Anthony Vacca
Patented Case
View Patent ↗
Granted: Dec 1, 1992
Filed: Nov 27, 1990
Inventors
Nicholas J. Krajewski
Carl D. Breske
David Johnson
David R. Kiefer
Kent T. McDaniel
William T. Moore
Michael R. Edwards
Bricky A. Stephenson
Anthony Vacca
Assignee (at issue)
Cray Research, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.