Granted Patent
Utility
US 5,169,586 · App. 07/702,242
Method of manufacturing resin-sealed type semiconductor device
Inventor:
Toshio Noda
Patented Case
View Patent ↗
Granted: Dec 8, 1992
Filed: May 17, 1991
Inventor
Toshio Noda
Assignee (at issue)
NEC CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.