Granted Patent
Utility
US 5,170,328 · App. 07/513,244
Packaging for molded carriers of integrated circuits
Inventor:
Victor D. Kruppa
Patented Case
View Patent ↗
Granted: Dec 8, 1992
Filed: Apr 24, 1990
Inventor
Victor D. Kruppa
Assignee (at issue)
DELCO ELECTRONICS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.