Granted Patent
Utility
US 5,173,451 · App. 07/889,008
Soft bond for semiconductor dies
Inventors:
Larry D. Kinsman, Derek Gochnour
Patented Case
View Patent ↗
Granted: Dec 22, 1992
Filed: May 26, 1992
Inventors
Larry D. Kinsman
Derek Gochnour
Assignee (at issue)
Micron Technology, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.