IP Library › Granted Patent US 5,175,613
Granted Patent Utility
US 5,175,613 · App. 07/644,401

Package for EMI, ESD, thermal, and mechanical shock protection of circuit chips

Inventors: Charles Barker, Richard J. Casabona, David Fenwick
Patented Case View Patent ↗
Granted: Dec 29, 1992 Filed: Jan 18, 1991
Inventors
Charles Barker
Richard J. Casabona
David Fenwick
Assignee (at issue)
Digital Equipment Corporation

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Quick Facts
Patent No.
US 5,175,613
App. No.
07/644,401
Filed
1991-01-18
Granted
1992-12-29
Kind
A