Granted Patent
Utility
US 5,192,713 · App. 07/658,239
Method of manufacturing semiconductor devices having multi-layered structure
Inventor:
Yusuke Harada
Patented Case
View Patent ↗
Granted: Mar 9, 1993
Filed: Feb 20, 1991
Inventor
Yusuke Harada
Assignee (at issue)
OKI ELECTRIC INDUSTRY CO., LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.