Granted Patent
Utility
US 5,200,367 · App. 07/787,484
Method for assembling packages of semi-conductor elements
Inventor:
Jun S. Ko
Patented Case
View Patent ↗
Granted: Apr 6, 1993
Filed: Nov 6, 1991
Inventor
Jun S. Ko
Assignee (at issue)
Goldstar Electron Co., Ltd.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.