Granted Patent
Utility
US 5,200,810 · App. 07/504,749
High density interconnect structure with top mounted components
Inventors:
Robert J. Wojnarowski, Charles W. Eichelberger
Patented Case
View Patent ↗
Granted: Apr 6, 1993
Filed: Apr 5, 1990
Inventors
Robert J. Wojnarowski
Charles W. Eichelberger
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.