Granted Patent
Utility
US 5,203,401 · App. 07/888,040
Wet micro-channel wafer chuck and cooling method
Inventors:
William Hamburgen, John S. Fitch
Patented Case
View Patent ↗
Granted: Apr 20, 1993
Filed: May 22, 1992
Inventors
William Hamburgen
John S. Fitch
Assignee (at issue)
Digital Equipment Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.