Granted Patent
Utility
US 5,211,565 · App. 07/854,312
High density interconnect apparatus
Inventors:
Nicholas J. Krajewski, Carl D. Breske, David Johnson, David R. Kiefer, Kent T. McDaniel, William T. Moore, Michael R. Edwards, Bricky A. Stephenson, Anthony Vacca
Patented Case
View Patent ↗
Granted: May 18, 1993
Filed: Mar 19, 1992
Inventors
Nicholas J. Krajewski
Carl D. Breske
David Johnson
David R. Kiefer
Kent T. McDaniel
William T. Moore
Michael R. Edwards
Bricky A. Stephenson
Anthony Vacca
Assignee (at issue)
Cray Research, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.