Granted Patent
Utility
US 5,211,764 · App. 07/973,908
Solder paste and method of using the same
Inventor:
Yinon Degani
Patented Case
View Patent ↗
Granted: May 18, 1993
Filed: Nov 10, 1992
Inventor
Yinon Degani
Assignee (at issue)
AT&T Bell Laboratories
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.