Granted Patent
Utility
US 5,214,261 · App. 07/790,914
Method and apparatus for dicing semiconductor substrates using an excimer laser beam
Inventor:
Pierino I. Zappella
Patented Case
View Patent ↗
Granted: May 25, 1993
Filed: Nov 13, 1991
Inventor
Pierino I. Zappella
Assignee (at issue)
Rockwell International Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.