Granted Patent
Utility
US 5,219,765 · App. 07/549,069
Method for manufacturing a semiconductor device including wafer aging, probe inspection, and feeding back the results of the inspection to the device fabrication process
Inventors:
Toru Yoshida, Suguru Sakaguchi, Aizo Kaneda, Kooji Serizawa, Munehisa Kishimoto, Masaaki Mutoh, Kunio Matsumoto, Isao Ohomori, Shingo Yorisaki
Patented Case
View Patent ↗
Granted: Jun 15, 1993
Filed: Jul 6, 1990
Inventors
Toru Yoshida
Suguru Sakaguchi
Aizo Kaneda
Kooji Serizawa
Munehisa Kishimoto
Masaaki Mutoh
Kunio Matsumoto
Isao Ohomori
Shingo Yorisaki
Assignee (at issue)
HITACHI, LTD.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.