Granted Patent
Utility
US 5,225,023 · App. 07/745,982
High density interconnect thermoplastic die attach material and solvent die attach processing
Inventors:
Robert J. Wojnarowski, Charles W. Eichelberger
Patented Case
View Patent ↗
Granted: Jul 6, 1993
Filed: Aug 5, 1991
Inventors
Robert J. Wojnarowski
Charles W. Eichelberger
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.