Granted Patent
Utility
US 5,226,232 · App. 07/743,462
Method for forming a conductive pattern on an integrated circuit
Inventor:
Melissa D. Boyd
Patented Case
View Patent ↗
Granted: Jul 13, 1993
Filed: Aug 9, 1991
Inventor
Melissa D. Boyd
Assignee (at issue)
Hewlett-Packard Company, L.P.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.