Granted Patent
Utility
US 5,228,192 · App. 07/825,133
Method of manufacturing a multi-layered IC packaging assembly
Inventor:
Matthew M. Salatino
Patented Case
View Patent ↗
Granted: Jul 20, 1993
Filed: Jan 24, 1992
Inventor
Matthew M. Salatino
Assignee (at issue)
HARRIS CORPORATION
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.