Granted Patent
Utility
US 5,229,727 · App. 07/850,809
Hermetically sealed microstrip to microstrip transition for printed circuit fabrication
Inventors:
Richard D. Clark, John A. MacDonald, John A. Windyka, Leonard H. Yorinks, Stephen C. Miller
Patented Case
View Patent ↗
Granted: Jul 20, 1993
Filed: Mar 13, 1992
Inventors
Richard D. Clark
John A. MacDonald
John A. Windyka
Leonard H. Yorinks
Stephen C. Miller
Assignee (at issue)
General Electric Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.