Granted Patent
Utility
US 5,237,203 · App. 07/893,617
Multilayer overlay interconnect for high-density packaging of circuit elements
Inventor:
Laurence I. Massaron
Patented Case
View Patent ↗
Granted: Aug 17, 1993
Filed: Jun 5, 1992
Inventor
Laurence I. Massaron
Assignee (at issue)
TRW Limited
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.