Granted Patent
Utility
US 5,249,728 · App. 08/029,148
Bumpless bonding process having multilayer metallization
Inventor:
Ken Lam
Patented Case
View Patent ↗
Granted: Oct 5, 1993
Filed: Mar 10, 1993
Inventor
Ken Lam
Assignee (at issue)
Atmel Corporation
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.