Granted Patent
Utility
US 5,255,156 · App. 07/756,319
Bonding pad interconnection on a multiple chip module having minimum channel width
Inventor:
Kou-Chaun Chang
Patented Case
View Patent ↗
Granted: Oct 19, 1993
Filed: Sep 6, 1991
Inventor
Kou-Chaun Chang
Assignee (at issue)
The Boeing Company
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.