Granted Patent
Utility
US 5,262,352 · App. 07/937,025
Method for forming an interconnection structure for conductive layers
Inventors:
Michael P. Woo, James D. Hayden, Richard D. Sivan, Howard C. Kirsch, Bich-Yen Nguyen
Patented Case
View Patent ↗
Granted: Nov 16, 1993
Filed: Aug 31, 1992
Inventors
Michael P. Woo
James D. Hayden
Richard D. Sivan
Howard C. Kirsch
Bich-Yen Nguyen
Assignee (at issue)
Motorola, Inc.
This patent predates the USPTO's electronic file wrapper — prosecution documents from this era exist only in the Patent Office's paper records. A certified copy of the file history can be ordered from the USPTO's paper archives.