IP Library Granted Patent US 5,263,991
Granted Patent Utility
US 5,263,991 · App. 07/964,373

Method for heating biocompatible implants in a thermal packaging line

Inventors: Roy C. Wiley, David R. Sarver
Patented Case View Patent ↗
Granted: Nov 23, 1993 Filed: Oct 21, 1992
Inventors
Roy C. Wiley
David R. Sarver
Assignee (at issue)
Biomet Limited

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Quick Facts
Patent No.
US 5,263,991
App. No.
07/964,373
Filed
1992-10-21
Granted
1993-11-23
Kind
A